We are seeking a Process Engineer Backend to work for a High-Tech Manufacturer in the Syracuse, NY area.
Whats in it for you?
Competitive Salary, Annual Bonus, Medical / Dental Benefits, Unlimited PTO, Restricted Stock Options and much more.
Outstanding Career Opportunity to Join a Start-Up Fab with over 100M in assets.
Key Duties and Responsibilities:
Develop backend wafer processes including wafer thinning, ohmic contacts and low kerf dicing.
You will work closely with product engineering, assembly, and device, teams, and with outsource service providers, to develop and qualify manufacturing processes
Development of novel ohmic contact metallurgies
Design and implementation of wafer handling fixturing and tools for thin (100 um) GaN wafers
Optimization of high-volume laser dicing processes
Qualification of tools and materials for back grinding and polishing of GaN wafers
Qualification and project management of outsource service providers
Documentation and traceability of critical manufacturing processes
Work closely with Device and Wafer Fab Engineering to achieve
Work with Assembly Engineering on package development
Education and Experience:
Minimum BS in Electrical Engineering, Chemical Engineering, Materials Science, or Physics. MS/PhD is desired.
The ideal candidate will have 5+ years of semiconductor process experience preferably with wide bandgap semiconductors, e.g. GaN, SiC.
Excellent oral and written communications skills.
Associated topics: mems, msee, processor, qubit, rtl logic, semiconductor, solder joint, surface mount, ttl, xilinx
* The salary listed in the header is an estimate based on salary data for similar jobs in the same area. Salary or compensation data found in the job description is accurate.